CB maintains the strength under severe conditions.

Durability of CB processed SUS / PBT
Bonding strength maintains after having been immersed in 95 ℃ sulfuric acid solution for1000 hours, a severe condition that PBT itself deteriorates.

CB technology’s bonding strength does not depend on metal material, but on formed chemical bonding.

Tensile strength (relative value)

Molecular bonding compounds: CB technology
Pre-treatment: roughening the surface (anchoring effect)

Bonding conditions: weld bonding at 260 ℃ for 1 minute
n = 5

When resin is bonded to cold-rolled steel plates and stainless steel, rolled aluminum, and aluminum die-cast
materials, the bonding strength by roughening surfaces varies very much depending on the irregularities on surface of each metal material (anchoring effect). When the material surfaces are pre-treated by the molecular bonding compounds prior to weld bonding , bonding strength maintains almost the same regardless of the metal material.

When bonding strength between metal materials and reactive functional group is high enough, the bonding strength is governed by the structure of the molecular bond compounds and their bonding capability to the resin, so that the strength does not depend on metal materials.

Hardly affected by decrease of hardness of the resin.

Red: Etching / Blue: CB processing
Metal: aluminum A5052
Resin: Polyamide 66, PA66 (contains glass fiber for 50%)
Test temperature / ℃

Changes in tensile strength by increasing test temperature show the difference between CB processing, which chemically binds metal and resin, and roughening surface by etching, in which the resin physically fills the irregularities on metal surface (anchor effect).
Test pieces are A5052 aluminum plate weld bonded with PA66 resin containing 60% of glass fiber.
The etched piece shows a linear decrease in bonding strength when the temperature increases. At 120 ℃, the bonding strength is lowered to less than 40% of it was at room temperature. It is considered that PA66 resin is softened by an increase in temperature, causing separation from the uneven metal surface.
In contrast, CB processed piece shows very gradual decrease; at 125 ℃, the strength retention ratio is more than 60%; even at 230 ℃ the ratio is retained more than 50%. As the interface between aluminum and PA66 resin is chemically bonded, the bonding strength maintains, resisting resin-softening.
CB processing enables to produce integrated products with excellent characteristics of metal (lightweight, high rigidity, electromagnetic shielding property, etc.) and of plastic (precise moldability, workability, flexibility, etc.) Please refer to the technical information column for more information of CB treatment.