CB processing

Chemical Bonding of not-treated bright copper foil and LCP film without adhesive

The following is the peel test results of copper foil laminating to Liquid Crystal Polymer (LCP) as a base film of Flexible Copper Clad Laminate (FCCL).
There is no need to perform etching or black oxide treatment (roughening treatment) on the copper foil because the Chemical Bonding bonds materials without any adhesive agent. Instead, CB processing bonds the no-roughening bright surface of the copper foil to the film by giving it heat to chemically bind them.

※Click here to see CB test results of polyimide film and copper foil.

180° peel test（JIS C 6471）
Peel speed: 50mm/min

[Comparison materials]
Copper foil: 20μm (bright surface)
LCP：　25μm　＋　50μm

180° peel test（JIS C 6471）
Peel speed: 50mm/min
[Comparison materials]
Copper foil: 18μm (black oxide treated surface)
LCP：　25μm　＋　50μm

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